Key Applications
- Software-defined Storage
- In-Memory Computing
- Scale Out All-Flash NVMe Storage
- Data Intensive HPC
- Private & Hybrid Cloud
- NVMe Over Fabrics Solution
- Enhanced Graphics&AI
- Generative AI
Key Features
- Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with P-cores Support CPU TDP up to 270W with air cooling
- Supports up to 4 TB of ECC DDR5 RDIMM/RDIMM 3DS/MRDIMM memory with speeds of up to 6400 MT/s (1DPC) or up to 5200 MT/s (2DPC) in 32 DIMM slots
- Flexible networking with up to 2 OCP 3.0 compatible AIOM slots
- Up to 2 PCIe 5.0 x16 FHHL + 2 PCIe 5.0 x16 AIOM slots
- Up to 16 front hot-swap E3.S 1T NVMe drive bays