Key Applications
- HPC
- IoT Gateway
- Deep Learning/AI/Machine Learning Development
- Scale-Out Object Storage
- Telco Edge
- MEC (Multi-Access Edge Computing)
- Multi-Purpose CDN
- Cluster Node
- GPU Virtualization (VDI)
- HPC cluster computer nodes
Key Features
- Single Socket BR (LGA-7529) Intel® Xeon® 6900 series processors with P-cores up to 500W with air cooling
- Up to 12 DIMMs supporting up to 3TB MRDIMM 8800 in 1DPC
- Flexible networking with up to 2 PCIe 5.0 x16 FH AOC + 1 optional AIOM slot
- Up to 2 PCIe 5.0 x16 FH10.5"L slots (1x double-width GPU or 2x single-width AOCs)
- GrandTwin front IO module offers additional value for networking expansion(10G/25G/200G).
- 2 Redundant 2200W Titanium (certification pending) Level power supplies